Substrate size | Max. Ø 2inch Single or piece |
---|---|
Substrate mechanism |
Rotation(Max. 20rpm) / Heating(Max.650℃) |
Sputtering type | Co-sputtering |
Target size | Ø 2inch x 1/4” or 1/16” thickness |
Power supply |
DC 1 kW (600VDC, 1set) RF 300W (13.56MHz, 2sets) |
Pumping unit |
Rotary pump(600L/min) + TMP (1,600L/sec) |
Base pressure | < 5x10-6 Torr |
Process gauge | CDG (upto 2torr) |
Vacuum gauge | Pirani gauge(2ea) / Ion gauge(1set) |
Gas flow | N2, O2, Ar |
System control | PLC + Touch |
Dimension | 1400W x 1794H x 1000D |